Structure and connection technology comprises the linking of microelectronic components with other components, such as PCBs, to form a comprehensive functional system.
The increasing variety of applications associated with microelectronics, sensor, and microsystem technology is constantly resulting in new packaging variants. On the other hand, there is enormous pressure on costs. Due to RoHS legislation and the ensuing changed technical requirements on circuit board systems, it is necessary to push the development of alternative surfaces. In order to meet the high demands on quality and reliability and identify weaknesses at an early stage, high-performance analytics is imperative.
Our SGS INSTITUT FRESENIUS specialists offer many years of experience in the examination of contact systems and other electronic assemblies.
You can also benefit from this wealth of experience and avail of our support in solving your technological problems!
Dismantling an electronic device can be as challenging as producing it and requires a lot of experience and expertise.
Design analysis make an essential contribution toward safeguarding the quality and reliability of microelectronic components.
With the help of imaging techniques and various preparation techniques, we can provide you with competent support in the quality control of your products.
We offer a wide selection of services in the area of product failure and damage analysis.
Mobile ions or ionic contamination in general have a negative impact on the reliability of microelectronic systems under certain environmental conditions. Click here for more information.
Counterfeit semiconductors cause high damages in the industry worldwide. Semiconductor testing services based on SAE AS6081 also give you assurance!
