Packaging and Assembly

What use is a semiconductor chip, a sensor or a microactuator without assembly?

The increasing variety of applications in microelectronics, sensor and microsystem technology continues to produce many new packaging variants. But this is also associated with enormous cost pressure. In order to satisfy the high quality and reliability requirements and discover weak points in good time, high-performance analytics are absolutely indispensable. We have many years of experience in testing contact systems and other installations and are able to interpret damage profiles in a technologically relevant manner.

Our range of services:

We investigate and evaluate for you:

• Devices non-destructive inspection chip bending, crystal defects heat sinking decapsulation and checking of assembly features Package cross section
• Contact systems wire bonds flip chips soldering and bonding problems inter-metallic compounds
• Metallization composition, contamination, topography
• Protective coatings and top-coats basic composition and additives
• Reliability problems corrosion phenomena passivating integrity migration

Contact:

SGS INSTITUT FRESENIUS GmbH
Königsbrücker Landstr. 161
D-01109 Dresden
t: +49 351 8841 - 0
f: +49 351 8841 – 190

E-Mail