Interconnection Systems

Over the last decades, scanning electron microscopy (SEM) and transmission electron microscopy (TEM) have developed into standard techniques for analysing integrated circuits.

In view of the increasing number of contacts and vias and the increasing density ofmetal lines, modern wafer production would be unimaginable without these inspection techniques.

Complicated preparations are often necessary before SEM and TEM analyses can be carried out.

SGS INSTITUT FRESENIUS has many years of experience in the field of sample preparation as well as in SEM and TEM analytics and uses these methods in a targeted fashion in combination with other processes.

Our range of services:

  • Cross-section preparation for SEM and TEM cleaving, grinding and polishing, chemical preparation, FIB cut
  • Parallel surface preparation for TEM
  • Backward preparation of layers wet etching, dry etching, horizontal polishing
  • Inspection by the means of SEM or TEM Detailed examination of contacts and layers, determination of the physical structure, determination of horizontal and vertical dimensions
  • Technological relevant evaluation of the results


Königsbrücker Landstr. 161
D-01109 Dresden
t: +49 351 8841 - 0
f: +49 351 8841 – 190


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